Semiconductor lead frame exterior plating service
Precision plating processes that support the semiconductor business.
Our company applies tin-based plating to the outer leads of semiconductor products, contributing to improved mounting strength and corrosion resistance on substrates. Additionally, we have established our own plating equipment (compatible with 300×100mm frames) to meet the diverse needs of our customers. 【Plating Equipment】 ■ Pure Sn exterior plating evaluation equipment (maximum 100×300mm) ■ Pure Sn exterior plating equipment (pure tin plating) ■ Sn-Ag exterior plating equipment (tin-silver plating) ■ Sn-Bi exterior plating equipment (tin-bismuth plating) ■ Sn-Pb exterior plating equipment (tin-lead plating), etc. *For more details, please download the PDF or feel free to contact us.
- Company：ミハラ電子
- Price：Other
